Single-sided plasma treatment device WLP-611S, WLP-600S
The device is high-performance and cost-effective, with a low price and the ability to manage various etching conditions through the built-in sequencer.
WLP has realized the application of RF power to the lower electrode (RIE method) or to the upper electrode (DP method) to accommodate diversified applications. It can be used for a variety of processes such as etching of 6-8 inch Si, Poly-Si, etching of polyimide-based resins, and ashing of photoresists.
- Company：エスクラフト
- Price：Other
